SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains, Indiana, West Lafayette Beloud

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SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains

SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains

SK hynix will invest $3.9 billion to build its first U.S. advanced packaging plant for High Bandwidth Memory (HBM) in West Lafayette, Indiana. The facility, supported by CHIPS Act grants, ai...

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